Compressible foamed thermal interface materials and methods of making the same
Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
1. A method of making a compressible foamed thermal interface material, the method comprising:
injecting gas into a cure-in-place thermal interface material before dispensing the cure-in-place thermal interface material and before curing the cure-in-place thermal interface material;
after injecting the gas, dispensing the cure-in-place thermal interface material onto a surface and exposing the cure-in-place thermal interface material to atmosphere, whereby the gas expands and causes the cure-in-place thermal interface material to foam thereby providing a foamed cure-in-place thermal interface material; and
after dispensing the cure-in-place thermal interface material, allowing the foamed cure-in-place thermal interface material to cure in place on the surface, thereby providing the compressible foamed thermal interface material on the surface;
whereby the compressible foamed thermal interface has a closed porosity, and the injected gas remains entrapped within closed pores of the compressible foamed thermal interface.
2. The method of claim 1 , wherein:
dispensing the cure-in-place thermal interface material onto a surface comprises dispensing the cure-in-place thermal interface material onto a cover of a board level shield (BLS) that is removably attachable to sidewalls of the BLS; and
allowing the foamed cure-in-place thermal interface material to cure in place on the surface comprises allowing the foamed cure-in-place thermal interface material to cure in place on the cover of the board level shield, thereby providing the compressible foamed thermal interface material on the cover of the board level shield.
3. The method claim 2 , wherein the method further includes compressing the compressible foamed thermal interface material along an interface between a heat source and the cover of the board level shield to thereby establish a thermally-conductive heat path having a thermal conductivity of at least about 1.5 Watts per meter Kelvin (W/mK) from the heat source through the compressible foamed thermal interface material to the cover of the board level shield, whereby the compressible foamed thermal interface material is expandable and contractable during thermal cycling without having to physically move the compressible foamed thermal interface material to or from the interface.
4. The method of claim 1 , wherein injecting gas into a cure-in-place thermal interface material comprises injecting gas into a two-part cure-in-place ceramic filled silicone-based thermal gap filler that is curable at room temperature and having a viscosity of no more than 260,000 centipoises (cps) before mixing, a thermal conductivity of at least about 2 Watts per meter Kelvin (W/mK), and a hardness (Shore 00) 3 second of no more than 45.
5. The method of claim 1 ,
wherein dispensing the cure-in-place thermal interface material onto a surface comprises dispensing the cure-in-place thermal interface material onto a surface of a board level shield, a housing, a heat source, and/or a heat dissipation/removal structure; and
wherein allowing the foamed cure-in-place thermal interface material to cure in place on the surface comprises allowing the foamed cure-in-place thermal interface material to cure in place on the surface of the board level shield, the housing, the heat source, and/or the heat dissipation/removal structure, thereby providing the compressible foamed thermal interface material on the surface of the board level shield, the housing, the heat source, and/or the heat dissipation/removal structure.
6. The method of claim 1 , wherein the compressible foamed thermal interface is expandable and contractable during thermal cycling without having to physically move the compressible foamed thermal interface material to or from an interface.
7. The method of claim 1 , wherein injecting gas into a cure-in-place thermal interface material comprises injecting nitrogen into a cure-in-place thermal interface material having a thermal conductivity of at least about 2 Watts per meter Kelvin (W/mK).
8. The method of claim 1 , wherein injecting gas into a cure-in-place thermal interface material comprises injecting gas into a thermoset two-part, silicone-based thermal gap filler.
9. The method of claim 1 , wherein injecting gas into a cure-in-place thermal interface material comprises injecting gas into a two-part cure-in-place thermal interface material that includes a first part A and a second part B, and wherein:
the first part A includes silicone, aluminum oxide, and melamine;
the second part B includes silicone, aluminum oxide, and melamine; and
one of the first part A or the second part B includes a catalyst for initiating the curing process.
10. The method of claim 9 , wherein:
the first part A and the second part B are separately introduced into and mixed within a mixer before injecting the gas; and
injecting the gas comprises injecting the gas into a mixture of the first part A and the second part B.
11. The method of claim 10 , wherein the compressible foamed thermal interface material consists of the first part A, the second part B, and the injected gas that remains within the closed pores of the compressible foamed thermal interface, and/or wherein the compressible foamed thermal interface material is made without using foaming agent.
12. The method of claim 1 , wherein injecting the gas comprises injecting the gas at least about 2000 revolutions per minute such that the gas is chopped and mixed into the cure-in-place thermal interface material.
13. The method of claim 1 , wherein:
the compressible foamed thermal interface has a lower thermal conductivity than the cure-in-place thermal interface material due to entrapped gas within the closed pores of the compressible foamed thermal interface; and
the compressible foamed thermal interface has a pore density within a range from about 20% to about 50%.
14. The method of claim 1 ,
wherein after exposing the cure-in-place thermal interface material to atmosphere after injecting the gas, the method further includes curing the foamed cure-in-place thermal interface material to thereby provide the compressible foamed thermal interface material.
15. The method claim 14 , wherein exposing the cure-in-place thermal interface material to atmosphere comprises dispensing the cure-in-place thermal interface material onto a surface for use between battery walls of an electrical vehicle whereby the compressible foamed thermal interface is expandable and contractable during thermal cycling without having to physically move the compressible foamed thermal interface material to or from an interface between the compressible foamed thermal interface material and one or more of the battery walls.
16. The method of claim 14 , wherein:
injecting gas into a cure-in-place thermal interface material comprises injecting gas into a cure-in-place thermal interface material having a thermal conductivity of at least about 2 Watts per meter Kelvin (W/mK); and
the compressible foamed thermal interface material has a thermal conductivity of at least about 1.5 Watts per meter Kelvin (W/mK), which is lower than the thermal conductivity of the cure-in-place thermal interface material due to the injected gas that remains entrapped within the closed pores of the compressible foamed thermal interface.
17. The method of claim 14 , wherein:
the cure-in-place thermal interface material includes a matrix and thermally-conductive filler within the matrix; and
the compressible foamed thermal interface consists essentially of the matrix, the thermally-conductive filler within the matrix, and the injected gas that remains entrapped within the closed pores of the compressible foamed thermal interface.
18. The method of claim 1 , wherein:
dispensing the cure-in-place thermal interface material onto a surface comprises dispensing the cure-in-place thermal interface material onto a surface of a board level shield, a housing, a heat source, and/or a heat dissipation/removal structure;
allowing the foamed cure-in-place thermal interface material to cure in place on the surface comprises curing the foamed cure-in-place thermal interface material on the surface of the board level shield, the housing, the heat source, and/or the heat dissipation/removal structure, thereby providing the compressible foamed thermal interface material on the surface of the board level shield, the housing, the heat source, and/or the heat dissipation/removal structure; and
the method includes compressing the compressible foamed thermal interface material along an interface between the heat source and the board level shield, the housing, and/or the heat dissipation/removal structure, such that the compressible foamed thermal interface material establishes a thermally-conductive heat path having a thermal conductivity of at least about 1.5 Watts per meter Kelvin (W/mK) from the heat source through the compressible foamed thermal interface material to the board level shield, the housing, and/or the heat dissipation/removal structure, and the compressible foamed thermal interface material is expandable and contractable during thermal cycling without having to physically move the compressible foamed thermal interface material to or from the interface.
19. The method of claim 1 , wherein:
the cure-in-place thermal interface material includes a matrix and thermally-conductive filler within the matrix; and
the compressible foamed thermal interface consists essentially of the matrix, the thermally-conductive filler within the matrix, and the injected gas that remains entrapped within the closed pores of the compressible foamed thermal interface.
20. The method of claim 1 , wherein:
injecting gas into a cure-in-place thermal interface material comprises injecting gas into a cure-in-place thermal interface material having a thermal conductivity of at least about 2 Watts per meter Kelvin (W/mK); and
the compressible foamed thermal interface material has a thermal conductivity of at least about 1.5 Watts per meter Kelvin (W/mK) that is lower than the thermal conductivity of the cure-in-place thermal interface material due to the injected gas that remains entrapped within the closed pores of the compressible foamed thermal interface.