Materials including thermally reversible gels
View Patent ↗Materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a material includes at least one filler in a thermally reversible gel.
1. A material comprising at least one filler in a thermally reversible gel including di-block and tri-block styrenic copolymers and process oil, wherein a ratio of the process oil to the di-block and tri-block styrenic copolymers is at least about 4 to 1 but not more than about 12 to 1, wherein the material comprises a pad formulated to be compliant against a surface of an electrical component at room temperature and during operation of the electrical component, and wherein the material includes the at least one filler and/or one or more additives in a total amount less than or equal to about 99 percent of the material by weight.
2. The material of claim 1 , wherein the ratio of the process oil to the di-block and tri-block styrenic copolymers is not more than about 5 to 1.
3. The material of claim 1 , wherein the ratio of the process oil to the di-block and tri-block styrenic copolymers is at least about 11 to 1.
4. The material of claim 1 , wherein the ratio of the process oil to the di-block and tri-block styrenic copolymers is about 4.5 to 1.
5. The material of claim 1 , wherein a ratio of the di-block styrenic copolymer to the tri-block styrenic copolymer is at least about 0.85 to 1 but not more than about 1.6 to 1.
6. The material of claim 1 , wherein a ratio of the di-block styrenic copolymer to the tri-block styrenic copolymer is at least about 1 to 1.
7. The material of claim 1 , wherein:
the ratio of the process oil to the di-block and tri-block styrenic copolymers is about 4.5 to 1; and
the ratio of the di-block styrenic copolymer to the tri-block styrenic copolymer is about 1.5 to 1.
8. The material of claim 1 , wherein:
the ratio of the process oil to the di-block and tri-block styrenic copolymers is about 11.1 to 1; and
the ratio of the di-block styrenic copolymer to the tri-block styrenic copolymer is about 1.5 to 1.
9. The material of claim 1 , wherein:
the ratio of the process oil to the di-block and tri-block styrenic copolymers is about 4.5 to 1; and
the ratio of the di-block styrenic copolymer to the tri-block styrenic copolymer is about 1.2 to 1.
10. The material of claim 1 , wherein:
the ratio of the process oil to the di-block and tri-block styrenic copolymers is about 4.4 to 1; and
the ratio of the di-block styrenic copolymer to the tri-block styrenic copolymer is about 1 to 1.
11. The material of claim 1 , wherein the material includes the at least one filler and/or one or more additives in a total amount that is at least about 40 percent but not more than about 99 percent of the material by weight.
12. The material of claim 1 , wherein the material has a hardness less than or equal to about 90 Shore 00.
13. The material of claim 1 , wherein the material has a hardness of at least 60 Shore 00 but not more than about 90 Shore 00.
14. The material of claim 1 , wherein:
a ratio of the di-block styrenic copolymer to the tri-block styrenic copolymer is at least about 0.85 to 1 but not more than about 1.6 to 1;
the material includes the at least one filler and/or one or more additives in a total amount that is about 40 percent to about 99 percent of the material by weight; and
the material has a hardness that is at least about 60 Shore 00 but not more than 90 Shore 00.
15. The material of claim 1 , wherein the at least one filler comprises an electrically-conductive filler.
16. The material of claim 15 , wherein the material comprises an electrically-conductive thermal insulator.
17. The material of claim 1 , wherein the at least one filler comprises an electromagnetic interference (EMI) absorber.
18. The material of claim 17 , wherein the material comprises an EMI absorbing thermal insulator.
19. The material of claim 1 , wherein the at least one filler comprises a thermally-conductive filler.
20. The material of claim 19 , wherein the material comprises a thermal interface material.
21. The material of claim 1 , wherein the at least one filler comprises an electrically-conductive filler, an electromagnetic interference (EMI) absorber, and/or a thermally-conductive filler.
22. A material comprising at least one filler in a thermally reversible gel including di-block and tri-block styrenic copolymers and process oil, wherein:
the material comprises a pad formulated to be compliant against a surface of a device at room temperature and during operation of the device; and
the material is silicone free, such that the material is usable with no occurrence of silicone migration or volatility due to the absence of silicone in the formulation.
23. A material comprising at least one filler in a thermally reversible gel including di-block and tri-block styrenic copolymers and process oil, wherein the material comprises a pad formulated to be compliant against a surface of a device at room temperature and during operation of the device.
24. The material of claim 23 , wherein:
the material has a hardness less than or equal to about 88 Shore 00;
the process oil is less than or equal to about 43.2 percent of the material by weight;
the di-block styrenic copolymer is less than or equal to about 5.3 percent of the material by weight;
a di-block and tri-block styrenic copolymer blend is less than or equal to about 10.6 percent of the material by weight, or the tri-block styrenic copolymer is less than or equal to about 6.7 percent of the material by weight; and
the at least one filler is less than or equal to about 98 percent of the material by weight.