Frames for shielding assemblies and shielding assemblies including the same
According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies. Exemplary embodiments are also disclosed of shielding assemblies including such frames. In exemplary embodiments, a frame for a board level shield (BLS) may include portions alignable with and solderable to solder ball pads along a printed circuit board. A cover may be releasably attachable to, detachable from, and reattachable to the frame.
1. A shielding assembly comprising a frame and a cover releasably attachable to, detachable from, and reattachable to the frame, wherein the frame comprises:
one or more sidewalls;
an eave extending inwardly along a bottom portion of the one or more sidewalls; and
one or more solderable tabs that extend inwardly along the eave, the one or more solderable tabs configured to be alienable with and solderable to one or more corresponding electrically-conductive portions along a substrate; and
wherein:
the cover includes one or more sidewalls positionable along inner surfaces of the corresponding one or more sidewalls of the frame; and
attachment of the cover to the frame is within a footprint or outer perimeter defined by the one or more sidewalls of the frame.
2. The shielding assembly of claim 1 , wherein the one or more solderable tabs comprise a plurality of solderable tabs spaced apart from each other along an inner perimeter defined by the eave.
3. The shielding assembly of claim 2 , wherein:
the plurality of solderable tabs and the eave cooperatively define a bottommost portion of the frame; and/or
the plurality of solderable tabs are substantially coplanar with the eave.
4. The shielding assembly of claim 3 , wherein the plurality of solderable tabs are alignable with and solderable to solder ball pads along a printed circuit board (PCB).
5. The shielding assembly of claim 4 , wherein the plurality of solderable tabs are configured for aligning with solder ball pads according to a preexisting PCB layout that includes or defines an arrangement or array of the solder ball pads along the PCB, whereby the frame is usable with a PCB having the preexisting PCB layout without requiring any changes to the preexisting PCB layout.
6. The shielding assembly of claim 3 , wherein the one or more sidewalls of the frame define an open top of the frame without an inwardly extending eave along the open top of the frame.
7. The shielding assembly of claim 1 , wherein:
the one or more solderable tabs and the eave cooperatively define a bottommost portion of the frame; and/or
the one or more solderable tabs are substantially coplanar with the eave.
8. The shielding assembly of claim 1 , wherein the one or more sidewalls of the frame define an open top of the frame without an inwardly extending eave along the open top of the frame.
9. A device comprising the shielding assembly of claim 1 and a printed circuit board (PCB) including a plurality of solder ball pads along the PCB, wherein the one or more solderable tabs of the frame comprise a plurality of solderable tabs that are spaced apart from each other along an inner perimeter defined by the eave and that are soldered to the corresponding solder ball pads along the PCB.
10. A board level shield comprising:
one or more sidewalls;
an eave extending inwardly along a bottom portion of the one or more sidewalls;
one or more solderable tabs that extend inwardly along the eave, the one or more solderable tabs configured to be alignable with and solderable to one or more corresponding electrically-conductive portions along a substrate; and
a cover releasably attachable to, detachable from, and reattachable to the one or more sidewalls;
wherein the cover includes one or more sidewalls positionable along inner surfaces of the corresponding one or more sidewalls of the board level shield, and attachment of the cover to the one or more sidewalls of the board level shield is within a footprint or outer perimeter defined by the one or more sidewalls of the board level shield.
11. The board level shield of claim 10 , wherein the one or more solderable tabs comprise a plurality of solderable tabs spaced apart from each other along an inner perimeter defined by the eave, and wherein:
the plurality of solderable tabs and the eave cooperatively define a bottommost portion of the frame; and/or
the plurality of solderable tabs are substantially coplanar with the eave.
12. The board level shield of claim 11 , wherein the board level shield comprises:
a frame that includes the one or more sidewalls of the board level shield, the eave, and the plurality of solderable tabs; and
the cover is releasably attachable to, detachable from, and reattachable to the frame, the one or more sidewalls of the cover are positionable along inner surfaces of the corresponding one or more sidewalls of the frame, and attachment of the cover to the frame is within a footprint or outer perimeter defined by the one or more sidewalls of the frame.
13. The board level shield of claim 11 , wherein the plurality of solderable tabs are configured for aligning with solder ball pads according to a preexisting PCB layout that includes or defines an arrangement or array of the solder ball pads along the PCB, whereby the board level shield is usable with a PCB having the preexisting PCB layout without requiring any changes to the preexisting PCB layout.
14. A device comprising the board level shield of claim 10 and a printed circuit board (PCB) including a plurality of solder ball pads along the PCB, wherein the one or more solderable tabs of the board level shield comprise a plurality of solderable tabs that are spaced apart from each other along an inner perimeter defined by the eave and that are soldered to the corresponding solder ball pads along the PCB.
15. A board level shield comprising:
a frame that includes one or more sidewalls, an eave extending inwardly along a bottom portion of the one or more sidewalls, and one or more solderable tabs that extend inwardly along the eave, the one or more solderable tabs configured to be alienable with and solderable to one or more corresponding electrically-conductive portions along a substrate; and
a cover releasably attachable to, detachable from, and reattachable to the frame;
wherein the one or more solderable tabs comprise a plurality of solderable tabs spaced apart from each other along an inner perimeter defined by the eave;
wherein the plurality of solderable tabs and the eave cooperatively define a bottommost portion of the frame; and/or the plurality of solderable tabs are substantially coplanar with the eave; and
wherein:
the one or more sidewalls of the frame define an open top of the frame without an inwardly extending eave along the open top of the frame, the cover is configured to cover the open top of the frame when the cover is attached to the frame, and the open top of the frame provides unimpeded access to one or more components through the frame's open top when the cover is not attached to the frame; and/or
the cover includes one or more sidewalls positionable along inner surfaces of the corresponding one or more sidewalls of the frame, and attachment of the cover to the frame is within a footprint or outer perimeter defined by the one or more sidewalls of the frame.