IP Library Granted Patent US 12,568,577
Granted Patent B2
US 12,568,577 · App. 18/302,258 · Granted Mar 3, 2026

Flexible copper-clad laminate and printed circuit made therefrom

Inventors: Shih-Ching Lin (Hsinchu, TW); Tung Lin Li (New Taipei City, TW)
H05K1/09B32B15/02B32B15/04B32B15/043B32B15/08B32B15/20C23C28/00C23C28/02C23C28/023C23C28/025C23C28/04C23C28/042C23C28/30C23C28/32C23C28/321C23C28/322C23C28/3225C23C28/34C23C28/345C23C28/3455C23C30/00C23C30/005H05K1/00H05K1/02H05K1/0237H05K1/0277H05K1/03H05K1/0326H05K1/11H05K3/022H05K3/382B32B2311/12B32B2379/08B32B2457/08H05K1/0393H05K2201/0154H05K2201/0355Y10T428/12431Y10T428/12438Y10T428/12493Y10T428/12556Y10T428/12569Y10T428/12576Y10T428/12583Y10T428/1259Y10T428/12597Y10T428/12604Y10T428/12611Y10T428/12618Y10T428/12882Y10T428/12903Y10T428/1291Y10T428/12993Y10T428/2495Y10T428/24959Y10T428/24967Y10T428/24975Y10T428/26Y10T428/263Y10T428/264Y10T428/265Y10T428/27Y10T428/273
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,568,577
App. No.
18/302,258
Granted
Mar 3, 2026
Kind
B2
Abstract

Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.

Claims (11)

1 . A flexible copper-clad laminate, comprising:

a surface-treated copper foil, characterized in that the surface-treated copper foil has an electric conductivity of 57.0×10 6 S/m or more, a cross-sectional average grain size of about 1 μm to about 2.5 μm, a thickness of about 3 μm to about 35 μm; and the surface-treated copper foil has a treated surface that has a surface roughness (Sz) of 3.0 μm or less, wherein the surface roughness (Sz) is measured at an outermost surface of the surface-treated copper foil according to ISO 25178; and

a dielectric layer provided on the treated surface of the surface-treated copper foil, wherein:

the dielectric layer has a thickness of about 5 μm to about 100 μm;

the dielectric layer is composed of a layer of a polymeric material having a thermal decomposition temperature (1%) of 260° C. or higher; and

the flexible copper-clad laminate has a peel strength of about 0.9 kN/m or more as measured according to IPC-TM 650.

2 . The flexible copper-clad laminate of claim 1 , wherein the dielectric layer has a Dk of 3.4 or less and a Df of 0.006 or less at a frequency of 10 GHz as measured according to IPC-TM 650 No. 2.5.5.13.

3 . The flexible copper-clad laminate of claim 1 , wherein the dielectric layer is composed of polyimide.

4 . A printed circuit board, that is manufactured from the flexible copper-clad laminate of claim 1 , wherein the printed circuit board is a flexible printed circuit board, a flexible-rigid printed circuit board or a rigid printed circuit board.

5 . The printed circuit board of claim 4 , which is a flexible printed circuit board that exhibits an insertion loss of 3.28 dB/10 cm or less at a frequency of 10 GHZ, or that exhibits an insertion loss of 6.10 dB/10 cm or less at a frequency of 28 GHz.

6 . An electronic device, comprising the printed circuit board of claim 4 .

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2023
From: LIN, SHIH-CHING; LI, TUNG LIN
To: DUPONT ELECTRONICS, INC.
Reel/Frame 064626/0909 →
Continuity (2)
Provisional Application 63335334 · Apr 27, 2022
Related Publication 20230354517A1 · Nov 2, 2023
References Cited (12)
US 20170032978A1 · Moriyama et al. · 2017 [cited by applicant]
US 20170188451A1 · Hu · 2017 [cited by examiner]
US 20180288884A1 · Ori et al. · 2018 [cited by applicant]
JP 2008159896A · 2008 [cited by applicant]
JP 2017025405A · 2017 [cited by examiner]
JP 2018172785A · 2018 [cited by examiner]
TW I339222B · 2011 [cited by applicant]
WO 2021220524A1 · 2021 [cited by applicant]
Machine Translation, Arai, JP 2018-172785 A, Nov. 8, 2018. (Year: 2018). [cited by examiner]
Machine Translation, Moriyama, JP 2017-025405 A, Feb. 2, 2017. (Year: 2017). [cited by examiner]
“Ultra Thin Copper Foil with Carrier Foil (Heat-Resistant Peelable Copper Foil) “F-HP”,” Furukawa Review, No. 38 (2010, no month), downloaded from www.furukawa.co.jp on Mar. 4, 2025 (two pages). (Year: 2010). [cited by examiner]
English Translation of Notice of Preliminary Rejection dated Nov. 12, 2025 for relevant Korean Patent application No. 10-2023-0055381. [cited by applicant]