IP Library Granted Patent US 8,895,228
Granted Patent B2
US 8,895,228 · App. 13/666,148 · Granted Nov 25, 2014

Method for thermal treatment of relief surface for a relief printing form

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Quick Facts
Patent No.
US 8,895,228
App. No.
13/666,148
Granted
Nov 25, 2014
Kind
B2
Abstract

The present invention pertains to a method for preparing a printing form from a photosensitive element by thermal treatment, wherein a gas jet emitting from a nozzle assembly impinges the exterior surface of the element to smooth or polish and mitigate marks and deformations that can be generated during development. Impingement with a heated gas jet provides surface polishing from rapid and specific convective heat flux to the exterior surface of the printing plate.

Claims (26)

1. A method for preparing a relief printing form from a photosensitive element having an exterior surface and comprising a layer of a photopolymerizable composition capable of being partially liquefied, comprising the steps of:

(a) heating the exterior surface to a temperature to cause a portion of the layer to liquefy and form liquefied material;

(b) contacting the photosensitive element with a development medium to allow the liquefied material to be removed by the development medium and to form a relief surface, whereby the development medium induces a mark on the relief surface; and

(c) impinging the exterior surface of the photosensitive element with a jet of a heated gas to at least mitigate the mark on the relief surface.

2. The method of claim 1 further comprising imagewise exposing the photosensitive element to actinic radiation prior to heating the exterior surface, whereby the contacting step forms the relief surface.

3. The method of claim 1 wherein the relief surface comprises one or more raised portions and one or more recessed portions, and the impinging step reduces or eliminates the mark on one or more raised portions.

4. The method of claim 1 further comprising repeating steps (a) and (b) two or more times, removing liquefied material to form the relief surface of the photopolymerizable layer, followed by at least one step (c).

5. The method of claim 1 wherein the jet of the heated gas impinging the exterior surface has temperature of 80° C. to 425° C.

6. The method of claim 1 wherein the jet of the heated gas impinging the exterior surface has temperature of 200° C. to 375° C.

7. The method of claim 1 further comprising transporting the photosensitive element by the impinging jet of heated gas at a transport speed to reduce or eliminate the mark in one or more passes.

8. The method of claim 1 wherein prior to step c) the exterior surface has a first gloss value, and after step c) the exterior surface has a second gloss value that is greater than the first gloss value.

9. The method of claim 1 wherein during step c) the element is not contacting the development medium.

10. The method of claim 1 wherein the relief surface comprises one or more raised printing elements and the mark is deformation of one or more of the raised printing elements, and the impinging step relaxes the deformation for printing by one or more of the raised printing elements.

11. The method of claim 1 wherein the jet of the heated gas impinging the exterior surface to at least mitigate the mark has a heat flux greater than 10 kiloWatts/m 2 (kW/m 2 ).

12. The method of claim 1 wherein the heating step comprises impinging the exterior surface with the jet of the heated gas emitting from a nozzle assembly.

13. The method of claim 12 wherein the nozzle assembly comprises an aperture forming a slot or a plurality of openings that is adapted to emit the jet of heat gas.

14. The method of claim 12 wherein the nozzle assembly comprises an aperture selected from a slot that is adapted to emit the jet of heated gas having a heat flux determined from the following relationship

heat flux=−32.5 (kW/m 2 )+[0.687 (kW-sec/m 3 )*velocity (m/sec)]+[0.203 (kW/m 2 ° C.)*temperature (° C.)]

or, from a plurality of openings that is adapted to emit the jet of heat gas having a heat flux determined from the following relationship

heat flux=−33.3 (kW/m 2 )+[1.77 (kW-sec/m 3 )*velocity (m/sec)]+[0.189 (kW/m 2 ° C.)*temperature (° C.)]

wherein the velocity is 15 to 30 meter/second and the temperature is 120° C. to 330° C.

15. The method of claim 12 further comprising transporting the photosensitive element by the impinging jet of heated gas at a development transport speed to cause a portion of the layer to soften or liquefy and form the liquefied material.

16. The method of claim 15 further comprising transporting the photosensitive element by the impinging jet of heated gas to at least mitigate the mark at a transport speed that is less than or equal to the development transport speed.

17. The method of claim 12 wherein the temperature of the jet of heated gas for heating to cause a portion of the layer to form the liquefied material is 120° C. to 330° C., and the temperature of the jet of heated gas for impinging to at least mitigate the mark is 225° C. to 350° C.

18. The method of claim 12 wherein a gap from an exit of the nozzle assembly to the exterior surface is 1 to 15 millimeters.

19. The method of claim 12 further comprising collecting a portion of the gas after impinging the exterior surface, and returning the collected gas to the nozzle assembly.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2013
From: ARNOLD, CARL BERNARD; KATO, MASAYUKI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 031105/0163 →