IP Library Granted Patent US 8,704,087
Granted Patent B2
US 8,704,087 · App. 13/150,648 · Granted Apr 22, 2014

Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications

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Quick Facts
Patent No.
US 8,704,087
App. No.
13/150,648
Granted
Apr 22, 2014
Kind
B2
Abstract

The invention is directed to a polymer thick film conductive composition comprising (a) a conductive silver-coated copper powder; and (b) an organic medium comprising two different resins and organic solvent, wherein the ratio of the weight of the conductive silver-coated copper powder to the total weight of the two different resins is between 5:1 and 45:1. The invention is further directed to a method of electrode grid and/or bus bar formation on thin-film photovoltaic cells using the composition and to cells formed from the method and the composition.

Claims (11)

1. A solderable polymer thick film conductive composition for forming a solderable polymer thick film electrode with electrode formation temperature less than about 200° C., said solderable polymer thick film conductive composition consisting essentially of:

(a) a conductive silver-coated copper powder; and

(b) an organic medium consisting of two different resins and organic solvent,

wherein the ratio of the weight of said conductive silver-coated copper powder to the total weight of said two different resins is between 5:1 and 45:1 and said two different resins are a phenoxy resin and a phenolic resin.

2. A solderable polymer thick film conductive composition for forming a solderable polymer thick film electrode with electrode formation temperature less than about 200° C., said solderable polymer thick film conductive composition consisting essentially of,

(a) 60 to 93 weight percent silver-coated copper powder;

(b) 7 to 40 weight percent organic medium consisting of two different resins and organic solvent, wherein the total weight of said two resins is 0.3 to 6 weight percent, wherein said conductive silver-coated copper powder is silver-coated copper flakes, wherein said two different resins are a phenoxy resin and a phenolic resin with 0.1 to 5.0 wt % phenoxy resin and 0.20 to 1.0 wt % phenolic resin and wherein the weight percents are based on the total weight of the solderable polymer thick film conductive composition.

3. The solderable polymer thick film conductive composition of claim 2 , wherein, based on the total weight of the composition, said silver-coated copper powder is 75 to 93 weight percent, the total weight of said two resins is 0.3 to 6 weight percent and said organic medium is 7 to 25 weight percent of said solderable polymer thick film conductive composition.

4. A thin-film photovoltaic cell comprising a conductive grid line and/or bus bars comprising the dried composition of claim 1 , wherein said dried composition of claim 1 has been dried at a temperature less than about 200° C. to form said conductive grid line and/or bus bars and wherein said resins remain as an integral art of said conductive rid line and/or bus bars.

5. A thin-film photovoltaic cell comprising a conductive grid line and/or bus bars comprising the dried composition of claim 3 , wherein said dried composition of claim 3 has been dried at a temperature less than about 200° C. to form said conductive grid line and/or bus bars and wherein said resins remain as an integral part of said conductive grid line and/or bus bars.

6. A thin-film photovoltaic cell comprising a conductive grid line and/or bus bars comprising the dried composition of claim 2 , wherein said dried composition of claim 4 has been dried at a temperature less than about 200° C. to form said conductive grid line and/or bus bars and wherein said resins remain as an integral part of said conductive grid line and/or bus bars.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2021
From: DUPONT ELECTRONICS, INC.
To: SOLAR PASTE, LLC
Reel/Frame 055766/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2011
From: DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 026439/0127 →