Light emitting diode assembly and thermal control blanket and methods relating thereto

1. A light emitting diode assembly comprising:

A. a filled polyimide layer having a filled polyimide layer first surface and a filled polyimide layer second surface; the filled polyimide layer consisting essentially of:

i). a polyimide in an amount from 50 to 75 weight percent of the filled polyimide layer, the polyimide being derived from:

a. at least 45 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, based on a total dianhydride content of the polyimide, and

b. at least 50 mole percent of 2,2′-bis(trifluoromethyl)benzidine based on a total diamine content of the polyimide;

ii). a white pigment particulate filler with a mean particle size less than 1.9 microns and in an amount from 25 to 50 weight percent of the filled polyimide layer;

B. electrically conductive circuit traces formed on at least the filled polyimide layer first surface;

C. at least one light emitting diode attached to the filled polyimide layer first surface or attached to the electrically conductive traces; and

D. an encapsulant covering exposed surfaces of the light emitting diode and at least a portion of the filled polyimide layer first surface.

2. The light emitting diode assembly of claim 1 wherein the filled polyimide layer additionally consisting essentially of sodium aluminum sulfosilicate pigment in an amount from 0.01 to 1 weight percent of the filled polyimide layer.

3. The light emitting diode assembly of claim 1 wherein the polyimide is derived from 100 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and 100 mole percent of 2,2′-bis(trifluoromethyl)benzidine and the white pigment particulate filler is titanium dioxide.

4. The light emitting diode assembly of claim 1 wherein the polyimide is derived from at least 50 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, based on a total dianhydride content of the polyimide.

5. The light emitting diode assembly of claim 1 wherein the polyimide is additionally derived from not more than 55 weight percent of 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) based on the total dianhydride content of the polyimide.

6. The light emitting diode assembly of claim 1 wherein the polyimide is additionally derived from not more than 55 weight percent of pyromellitic dianhydride based on the total dianhydride content of the polyimide.

7. The light emitting diode assembly of claim 1 wherein the polyimide is additionally derived from no more than 50 mole percent of trans-1,4-diaminocyclohexane; 3,5-diaminobenzotrifluoride; 2-(trifluoromethyl)-1,4-phenylenediamine; 1,3-diamino-2,4,5,6-tetrafluorobenzene; 2,2-bis(3-aminophenyl) 1,1,1,3,3,3-hexafluoropropane; 2,2′-bis-(4-aminophenyl)-hexafluoropropane (6F diamine); 3,4′-oxydianiline (3,4′-ODA), m-phenylene diamine (MPD), 4,4-bis(trifluoromethoxy)benzidine, 3,3′-diamino-5,5′-trifluoromethyl biphenyl, 3,3′-diamino-6,6′-trifluoromethyl biphenyl, 3,3′-bis(trifluoromethyl)benzidine; 2,2-Bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (4-BDAF), 4,4′-diaminodiphenyl sulfide (4,4′-DDS); 3,3′-diaminodiphenyl sulfone (3,3′-DDS); 4,4′-diaminodiphenyl sulfone; 2,2′-bis(dimethyl)benzidine; 3,3′-bis(dimethyl)benzidine; 4,4′-trifluoromethyl-2,2′-diaminobiphenyl or mixtures thereof based on the total diamine content of the polyimide.

8. The light emitting diode assembly of claim 1 wherein the encapsulant is a silicone or epoxy resin.

9. The light emitting diode assembly of claim 1 additionally comprising a solder mask, the solder mask consisting essentially of:

i). a polyimide in an amount from 50 to 75 weight percent of the solder mask, the polyimide being derived from:

a. at least 45 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, based on a total dianhydride content of the polyimide, and

b. at least 50 mole percent of 2,2′-bis(trifluoromethyl)benzidine based on a total diamine content of the polyimide;

ii). a white pigment particulate filler with a mean particle size less than 1.9 microns in an amount from 20 to 50 weight percent of the solder mask.

10. A thermal control blanket comprising a filled polyimide layer; the filled polyimide layer consisting essentially of:

A. a polyimide in an amount from 50 to 75 weight percent of the filled polyimide layer, the polyimide being derived from:

a) at least 45 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, based on a total dianhydride content of the polyimide,

b) at least 50 mole percent of 2,2′-bis(trifluoromethyl)benzidine based on a total diamine content of the polyimide; and

B. white pigment particulate filler in an amount from 25 to 50 weight percent of the filled polyimide layer and having a mean particle size less than 1.5 microns;

C. an electrically conductive filler is present in an amount from 2 to 5 weight percent of the filled polyimide layer;

wherein the thermal control blanket has an L-color of at least 85 determined by ASTM E308 [10° observer and illuminant D65] and a reflectivity of at least 80 percent measured according to ASTM E1164.

11. The thermal control blanket of claim 10 wherein the filled polyimide layer additionally comprises a sodium aluminum sulfosilicate pigment in an amount from 0.01 to 1 weight percent of the filled polyimide layer.

12. The thermal control blanket of claim 10 wherein the polyimide is derived from 100 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and 100 mole percent of 2,2′-bis(trifluoromethyl)benzidine and the white pigment particulate filler is titanium dioxide.

13. The thermal control blanket of claim 10 wherein the polyimide is derived from at least 50 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, based on a total dianhydride content of the polyimide.

14. The thermal control blanket of claim 10 wherein the polyimide is additionally derived from not more than 55 weight percent of 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) based on the total dianhydride content of the polyimide.

15. The thermal control blanket of claim 10 wherein the polyimide is additionally derived from not more than 55 weight percent of pyromellitic dianhydride based on the total dianhydride content of the polyimide.

16. The thermal control blanket of claim 10 wherein the polyimide is additionally derived from no more than 50 mole percent of trans-1,4-diaminocyclohexane; 3,5-diaminobenzotrifluoride; 2-(trifluoromethyl)-1,4-phenylenediamine; 1,3-diamino-2,4,5,6-tetrafluorobenzene; 2,2-bis(3-aminophenyl) 1,1,1,3,3,3-hexafluoropropane; 2,2′-bis-(4-aminophenyl)-hexafluoropropane (6F diamine); 3,4′-oxydianiline (3,4′-ODA), m-phenylene diamine (MPD), 4,4-bis(trifluoromethoxy)benzidine, 3,3′-diamino-5,5′-trifluoromethyl biphenyl, 3,3′-diamino-6,6′-trifluoromethyl biphenyl, 3,3′-bis(trifluoromethyl)benzidine; 2,2-Bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (4-BDAF), 4,4′-diaminodiphenyl sulfide (4,4′-DDS); 3,3′-diaminodiphenyl sulfone (3,3′-DDS); 4,4′-diaminodiphenyl sulfone; 2,2′-bis(dimethyl)benzidine; 3,3′-bis(dimethyl)benzidine; 4,4′-trifluoromethyl-2,2′-diaminobiphenyl and derivatives thereof based on the total diamine content of the polyimide.

17. The thermal control blanket of claim 10 wherein the electrically conductive filler is selected from the group consisting of carbon, carbon black, graphite, metal particles and mixtures thereof.

18. The thermal control blanket of claim 10 additionally comprising an adhesive on at least one side of the thermal control blanket, wherein the adhesive is an epoxy adhesive, acrylic adhesive or methacrylic adhesive.

19. The thermal control blanket of claim 10 additionally comprising a metal oxide adhesion promoter layer on at least one side of the thermal control blanket.