IP Library Granted Patent US 8,715,453
Granted Patent B2
US 8,715,453 · App. 13/327,795 · Granted May 6, 2014

Method for preparing consolidated multi-layer article using curable epoxy composition with quaternary ammonium bicarbonate curing catalyst

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Quick Facts
Patent No.
US 8,715,453
App. No.
13/327,795
Granted
May 6, 2014
Kind
B2
Abstract

Quaternary ammonium bicarbonates are suitable for use as catalysts in curable epoxy compositions. The curable compositions prepared therewith are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Methods for preparation and curing are also provided. Of particular utility are compositions comprising benzytrimethyl ammonium bicarbonate. The curable composition is coated onto a first film or sheet, including a polyimide film or sheet. The coated sheet is then contacted to the surface of second film or sheet, where preferably there are discrete metallic conductive pathways disposed thereupon.

Claims (13)

1. A method for preparing a multilayer article comprising contacting a film or sheet having a coating to an article having a surface such that said coating is disposed between said film or sheet and said surface, thereby forming an unconsolidated multilayer article; applying heat and pressure to said multilayer article thereby forming a consolidated multilayer article, said coating comprising an uncured epoxy composition comprising a combination of an uncured epoxy, a phenolic curing agent, and a quaternary ammonium bicarbonate, wherein said uncured epoxy is advanced to 45 to 85% cure; and, wherein said quaternary ammonium bicarbonate is represented by Structure I

R 1 R 2 R 3 R 4 N + HCO 3 −   I

wherein each of R1, R2, R3, and R4 are independently alkyl, phenyl, alkylbenzene, or alkoxy.

2. The method of claim 1 wherein the quaternary ammonium bicarbonate is benzyltrimethyl ammonium bicarbonate.

3. The method of claim 1 wherein the epoxy is advanced to 55 to 75% cure.

4. The method of claim 1 wherein the epoxy comprises bisphenol A or bisphenol F.

5. The method of claim 1 wherein the surface further comprises one or more discrete metallic conductive pathways.

6. The method of claim 1 further comprising heating to a temperature in the range of 100-180° C.

7. The method of claim 6 wherein the epoxy comprises bisphenol A or bisphenol F, the quaternary ammonium bicarbonate is benzyltrimethyl ammonium bicarbonate, the epoxy is advanced to 55 to 75% cure, and the surface comprises one or more discrete metallic conductive pathways.

8. The method of claim 1 wherein said film or sheet is a polyimide film or sheet.

9. The method of claim 7 wherein said film or sheet is a polyimide film or sheet.

10. The method of claim 8 wherein said polyimide is a fully aromatic polyimide.

11. The method of claim 9 wherein said film or sheet is a fully aromatic polyimide.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2014
From: LIN, PUI-YAN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 032003/0161 →