Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom

1. A thick film conductive composition comprising:

(a) electroconductive metal particles comprising a mixture of Ag particles and Al particles

(b) glass frit wherein said glass frit is Pb-free; dispersed in

(c) an organic medium,

wherein the average diameter of said electroconductive metal particles is in the range of 0.5-10.0 μm,

wherein said glass frit comprises, in weight percent total glass fit composition: SiO 2 0.5- 35, Al 2 O 3 0-5, B2O3 1-15, ZnO 0-15, and Bi 2 O 3 55-90, and further comprising:

(d) one or more inorganic additives, wherein said inorganic additives are selected from the group consisting of (1) Cu and Bi; (2) compounds that can generate elemental metals selected from Cu and Bi; (3) oxides of Cu and Bi; and (4) mixtures thereof.

2. The composition of claim 1 further comprising one or more inorganic additives that are selected from the group consisting of (1) TiB2, Ti, Al, Sn, Sb, Cr, Fe, Mn, Co, Ni, Ru, and B; (2) compounds that can generate elemental metals selected from, Ti, Al, Sn, Sb, Cr, Fe, Mn, Co, Ni, Ru, B and; (3) oxides of, Ti, Al, Sn, Sb, Cr, Fe, Mn, Co, Ni, Ru, and B; and (4) mixtures thereof.

3. The composition of claim 1 comprising, based on weight percent total composition: 40-93 weight percent Ag particles, 2-10 weight percent of said glass frit, 1-5 weight percent Al particles and 5-50 weight percent organic medium.

4. the thick film composition of claim 1 wherein said electroconductive metal particles are in the form selected from (1) flakes, (2) spherical and (3) mixtures thereof.

5. The thick film composition of claim 1 wherein the softening point of said glass frit is in the range of 300°-550° C.

6. An electrode formed from the composition of claim 1 wherein said composition has been fired to remove the organic medium and sinter said glass frit.

7. A semiconductor device comprising the electrode of claim 6 .