Fine silver particle dispersion
This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.
1. A method of manufacturing an electrically conductive thick film comprising steps of:
(a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises no glass frit, wherein the fine silver particle dispersion comprises,
(i) 80.8 to 84.7 wt % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm;
(ii) 14.4-17.4 wt % of a solvent, wherein the solvent is selected from the group consisting of diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol monobutyl ether acetate, and a mixture thereof; and
(iii) 0.9 to 1.8 wt % of an ethyl cellulose resin having a weight-average molecular weight of 23,000 to 300,000, wherein the weight percentages are based on the weight of the fine silver particle dispersion, and wherein the resin and the solvent are such that a viscosity of a mixture of the resin and the solvent at a weight ratio (resin:solvent) of 1:9 is 0.1 to 30 Pa•s; and
(b) sintering the applied fine silver particle dispersion at 95 to 410° C.
2. The method of claim 1 , wherein the fine silver particles are coated with an organic protective material.
3. The method of claim 2 , wherein the organic protective material is an amine with carbon number from 8 to 12.
4. The method of claim 1 , wherein boiling of the solvent is 150 to 350° C.
5. The method of claim 1 , wherein molecular weight of the resin is 38,000 to 280,000.
6. The method of claim 1 , wherein viscosity of the fine silver particle dispersion is 30 to 350 Pa•s.