Patent Assignment
Reel/Frame 013057/0096
Assignment of Assignor's Interest
Recorded: 2002-07-02
Pages: 2
Assignee
HEWLETT-PACKARD COMPANY
INTELLECTUAL PROPERTY ADMINISTRATION, P.O. BOX 272400, FORT COLLINS, COLORADO, 80527
Covered Property
(1)
Wrap- Around Cooling Arrangement for Printed Circuit Board
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2003
From: SIMON, GLENN C.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 013881/0689 →
Assignment of Assignor's Interest
Jun 18, 2003
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 013776/0928 →
Assignment of Assignor's Interest
Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
Patent Assignment, Security Interest, and Lien Agreement
Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
Assignment of Assignor's Interest
Feb 24, 2021
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 055403/0001 →