IP Library Assignment 013091/0377
Patent Assignment
Reel/Frame 013091/0377

Assignment of Assignor's Interest

Recorded: 2002-07-16 Received: 2002-07-19 Pages: 2
Assignors
BAI, JIN-CHYUNG
Executed: 2002-03-18
LEE, CHENG-HUI
Executed: 2002-03-18
SHAN, WEIHENG
Executed: 2002-03-18
Assignee
UNITED TEST CENTER INC.
SCIENCE-BASED INDUSTRIAL PARK, NO. 2, LI-HSIN RD. 3, HSIN CHU R.O.C., TWX, TAIWAN
Covered Properties (2)
Thermally Enhanced Ic Chip Package
Application: 10/134,487 →
Novel human EGF-family proteins and polynucleotides encoding the same
Application: 60/286,141 →