Granted Patent
Utility
US 6,614,660
· Confirmation No. 3829
THERMALLY ENHANCED IC CHIP PACKAGE
Patented Case
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-04-30 | TRNA |
Transmittal of New Application | 3 | View | |
| 2002-04-30 | A.PE |
Preliminary Amendment | 3 | View | |
| 2002-04-30 | SPEC |
Specification | 5 | View | |
| 2002-04-30 | CLM |
Claims | 2 | View | |
| 2002-04-30 | ABST |
Abstract | 1 | View | |
| 2002-04-30 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2002-04-30 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
361/719
H10W40/10
H10W72/536
H10W72/884
H10W72/5363
H10W74/00
H10W72/5522
H10W70/68
Prosecution
- Examiner
- TOLIN, GERALD P
- Art Unit
- 2835
- Customer No.
- 1444
- Docket No.
- BAI=4
- Confirmation No.
- 3829
Patent Term Adjustment
0days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2017-12-22
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-10-10
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-07-16
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Quick Facts
- Patent No.
- US 6,614,660
- App. No.
- 10/134,487
- Filed
- 2002-04-30
- Granted
- 2003-09-02
- Examiner
- TOLIN, GERALD P
- Art Unit
- 2835
- PTA
- 0 days
External Links