Patent Assignment
Reel/Frame 044467/0697
Assignment of Assignor's Interest
Recorded: 2017-12-22
Pages: 7
Assignor
UTAC (TAIWAN) CORPORATION
Executed: 2015-05-08
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Properties
(34)
Chip scale packaging method
Patent:
6,190,943 →
Application:
09/589,197 →
Low profile semiconductor package and process for making the same
Patent:
6,326,700 →
Application:
09/639,202 →
Low Profile Optically-Sensitive Semiconductor Package
Semiconductor Device and Method for Fabricating Same
Printed Circuit Board Micro Hole Processing Method
Low Profile Stack Semiconductor Package
Patent:
6,555,919 →
Application:
10/127,918 →
Low Profile Stack Semiconductor Package
Thermally Enhanced Ic Chip Package
Patent:
6,614,660 →
Application:
10/134,487 →
Printed Circuit Board Having Permanent Solder Mask
Fabrication Method for Circuit Board
Semiconductor Package and Method for Fabricating the Same
Fabrication Method of Circuit Board
Mold Structure for Package Fabrication
Test Fixture for Semiconductor Package and Test Method of Using the Same
Encapsulated Semiconductor Package Free of Chip Carrier
Bonding Pads of Printed Circuit Board Capable of Holding Solder Balls Securely
Semiconductor Device and Method for Fabricating the Same
Double-Sided Thermally Enhanced Ic Chip Package
Stacked Chip Package with Enhanced Thermal Conductivity
Multi-Chip Semiconductor Package and Fabrication Method Thereof
Window-Type Semiconductor Package and Fabrication Method Thereof
Window-Type Ball Grid Array Semiconductor Package
Strengthened Window-Type Semiconductor Package
Fabrication Method of Window-Type Ball Grid Array Semiconductor Package
Stacked Multi-Chip Semiconductor Package and Fabrication Method Thereof
Patent:
6,713,857 →
Application:
10/314,064 →
Light Sensitive Semiconductor Package and Fabrication Method Thereof
Patent:
6,849,915 →
Application:
10/649,847 →
Semiconductor Package with Heat Sink
Printed Circuit Board Having Permanent Solder Mask
Method of Manufacturing Semiconductor Packages and a Clamping Device for Manufacturing a Semiconductor Package
Patent:
6,933,178 →
Application:
10/829,411 →
Substrate for Solder Joint
Semiconductor Device and Method for Fabricating the Same
Method for Fabricating Window Ball Grid Array Semiconductor Package
Multi-Chip Semiconductor Package and Fabrication Method Thereof
Semiconductor Device and Method for Fabricating the Same
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 12, 2001
From: BAI, JIN CHUAN
To: UNITED TEST CENTER, INC.
Reel/Frame 012253/0357 →
Assignment of Assignor's Interest
Nov 23, 2001
From: TSAO, CHING-HUA; TSENG, JOU-YUAN; LIU, KANG-TSUN
To: S & S TECHNOLOGY CORPORATION
Reel/Frame 012317/0059 →
Assignment of Assignor's Interest
Oct 10, 2003
From: UNITED TEST CENTER, INC.
To: ULTRATERA CORPORATION
Reel/Frame 014588/0024 →
Change of Name
Dec 6, 2004
From: UNITED TEST CENTER INC.
To: ULTRATERA CORPORATION
Reel/Frame 015417/0262 →
Change of Name
Apr 21, 2005
From: UNITED TEST CENTER INC.
To: ULTRATERA CORPORATION
Reel/Frame 015928/0108 →
Merger
Dec 18, 2017
From: S & S TECHNOLOGY CORPORATION
To: ULTRATERA CORPORATION
Reel/Frame 044415/0574 →
Change of Name
Dec 18, 2017
From: UNITED TEST CENTER INC.
To: ULTRATERA CORPORATION
Reel/Frame 044415/0509 →
Change of Name
Dec 19, 2017
From: ULTRATERA CORPORATION
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 044442/0224 →
Assignment of Assignor's Interest
Aug 3, 2020
From: UTAC HEADQUARTERS PTE. LTD.
To: UTAC TAIWAN HOLDINGS
Reel/Frame 053377/0933 →
Assignment of Assignor's Interest
Jun 7, 2021
From: UTAC TAIWAN HOLDINGS
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 056452/0177 →
Assignment of Assignor's Interest
Jun 7, 2021
From: UTAC TAIWAN HOLDINGS
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 056452/0197 →
Assignment of Assignor's Interest
Jun 7, 2021
From: UTAC TAIWAN HOLDINGS
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 056452/0530 →
Assignment of Assignor's Interest
Jun 7, 2021
From: UTAC TAIWAN HOLDINGS
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 056452/0575 →
Assignment of Assignor's Interest
Jun 7, 2021
From: UTAC TAIWAN HOLDINGS
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 056452/0606 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058113/0940 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058113/0873 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058113/0241 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058113/0109 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058112/0833 →