Fabrication method of circuit board
View Patent ↗A fabrication method of a circuit board is proposed, wherein a core layer is formed with a plurality of conductive traces, and photo resist is respectively applied on terminals of the conductive traces. Then, a non-solderable material is applied over the core layer as to cover the conductive traces except for the insulating material, and the non-solderable material is adapted to be surface-flush with the insulating material, allowing the insulating material to be exposed from the non-solderable material. Finally, the insulating material is removed from the core layer to expose the terminals of the conductive traces, wherein the exposed terminals are used as bond pads or bond fingers where solder balls, solder bumps or bonding wires can be bonded. This circuit board is cost-effectively fabricated by simplified processes, and beneficial in precisely exposing bond pads or bond fingers, thereby significantly improving yield of fabricated circuit boards.
1. A fabrication method of a circuit board, comprising the steps of:
preparing a core layer that is formed with a plurality of conductive traces on at least one surface thereof, each of the conductive traces being formed with a terminal;
applying an insulating material over a part of the surface of the core layer where the terminals are formed, so as to cover the terminal of each of the conductive traces;
applying a non-solderable material on the other part of the surface of the core layer such that the non-solderable material is surface-flush with the insulating material so as to allow the insulating material to be exposed from the non-solderable material; and
removing the insulating material to expose the terminals of the conductive traces.
2. The fabrication method of claim 1 , wherein the insulating material is photo resist.
3. The fabrication method of claim 1 , wherein the insulating material partly covers the terminal of the conductive trace.
4. The fabrication method of claim 1 , wherein the insulating material entirely covers the terminal of the conductive trace.
5. The fabrication method of claim 1 , wherein the terminal is a bond pad.
6. The fabrication method of claim 1 , wherein the terminal is a bond finger.
7. The fabrication method of claim 1 , wherein the non-solderable material has coefficient of thermal expansion similar to that of the core layer.
8. The fabrication method of claim 1 , wherein the non-solderable material has coefficient of thermal expansion same as that of the core layer.
9. The fabrication method of claim 1 , wherein the non-solderable material is applied over the surface of the core layer by printing technique.
10. The fabrication method of claim 1 , wherein the non-solderable material is applied over the surface of the core layer by molding technique.
11. The fabrication method of claim 1 , wherein the insulating material is removed by etching technique of using chemical solvents.