Granted Patent
Utility
US 6,614,660 · App. 10/134,487
Thermally enhanced IC chip package
Inventors:
Jin-Chyung Bai, Cheng-Hui Lee, Weiheng Shan
Patented Case
View Patent ↗
Granted: Sep 2, 2003
Filed: Apr 30, 2002
Inventors
Jin-Chyung Bai
Cheng-Hui Lee
Weiheng Shan
Assignee (at issue)
Ultratera Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.