Multi-chip semiconductor package and fabrication method thereof
View Patent ↗A multi-chip semiconductor package and a fabrication method thereof are provided. A substrate having an upper surface and a lower surface is prepared. At least a first chip is mounted on the upper surface of the substrate. A non-conductive material is applied over predetermined area on the first chip and the upper surface of the substrate. At least a second chip is mounted on the non-conductive material, and formed with at least a suspending portion free of interference in position with the first chip, wherein the non-conductive material is dimensioned in surface area at least corresponding to the second chip, so as to allow the suspending portion to be supported on the non-conductive material. With the second chip being completely supported on the non-conductive material without causing a conventional chip-crack problem, structural intactness and reliability can be effectively assured for fabricated package products.
1. A multi-chip semiconductor package, comprising:
a substrate having an upper surface and a lower surface opposed to the upper surface;
at least a first chip mounted on the upper surface of the substrate;
a non-conductive material applied over predetermined area on the first chip and the upper surface of the substrate, wherein the non-conductive material is an elastic adhesive;
at least a second chip mounted on the non-conductive material, and formed with at least a suspending portion free of interference in position with the first chip, the non-conductive material having a chip contact portion formed on an upper surface of the first chip and at least a substrate contact portion formed on the upper surface of the substrate, wherein the non-conductive material is dimensioned in surface area at least corresponding to the second chip, so as to allow the suspending portion to be supported directly on the substrate contact portion of the non-conductive material; and
an encapsulant formed on the upper surface of the substrate for encapsulating the first and second chips.
2. The semiconductor package of claim 1 , further comprising: a plurality of solder balls implanted on the lower surface of the substrate.
3. The semiconductor package of claim 1 , wherein the non-conductive material is interposed between the first and second chips.
4. The semiconductor package of claim 1 , wherein the second chip is arranged in a stagger manner with respect to the first chip.
5. The semiconductor package of claim 1 , wherein the second chip is arranged in a parallel manner with respect to the first chip.
6. The semiconductor package of claim 1 , wherein the second chip is larger in surface area than the first chip.
7. The semiconductor package of claim 1 , wherein the first and second chips are each electrically connected to the substrate by a plurality of bonding wires.