Substrate for solder joint
View Patent ↗A substrate for solder joint is provided, including: a core layer; at least one conductive trace formed on the core layer and having a circular terminal as a pad through which a plurality of hollow portions are formed and expose predetermined portions of the core layer underneath the pad, wherein the hollow portions are arranged at equal intervals and spaced from a periphery of the circular pad; and a solder mask for covering the conductive trace and having at least one opening bordered across each of the hollow portions of the pad, such that part of the pad and part of each of the predetermined portions of the core layer are exposed via the opening, to allow a conductive element to be bonded to the exposed part of the pad and the exposed part of the predetermined portions of the core layer in the opening of the solder mask.
1. A substrate for solder joint, comprising:
a core layer;
at least one conductive trace formed on a surface of the core layer and having a circular terminal that serves as a pad through which a plurality of hollow portions are formed and thereby expose predetermined portions of the core layer underneath the pad, wherein the hollow portions are arranged at equal intervals and spaced from a periphery of the circular pad; and
a solder mask applied over the surface of the core layer for covering the conductive trace, and formed with at least one opening that corresponds in position to the circular pad and is sized smaller than the pad, the opening being bordered across each of the hollow portions of the pad, such that part of the pad and part of each of the predetermined portions of the core layer are exposed via the opening, while the rest part of the pad and the rest part of the predetermined portions of the core layer are covered by the solder mask, so as to allow a conductive element to be bonded to the exposed part of the pad and the exposed part of the predetermined portions of the core layer in the opening of the solder mask.
2. The substrate of claim 1 , wherein the hollow portion is circular.
3. The substrate of claim 1 , wherein the opening of the solder mask is circular.
4. The substrate of claim 1 , wherein the core layer is made a resin material selected from the group consisting of epoxy resin, polyimide resin, BT (bismaleimide triazine) resin, FR4 resin, and FR5 resin.
5. The substrate of claim 1 , wherein the conductive trace is made of copper or copper alloy.
6. The substrate of claim 1 , wherein the conductive element is a solder ball or bump.
7. The substrate of claim 1 , wherein the hollow portion of the pad is oval.
8. The substrate of claim 7 , wherein the oval hollow portion has its tip end directed toward the center of the pad.
9. The substrate of claim 8 , wherein the exposed part of the predetermined portion of the core layer is located beside the tip end of the hollow portion and thus relatively closer to the center of the pad.