Granted Patent
Utility
US 6,713,856 · App. 10/232,729
Stacked chip package with enhanced thermal conductivity
Inventors:
Chung-Che Tsai, Wei Shan
Patented Case
View Patent ↗
Granted: Mar 30, 2004
Filed: Sep 3, 2002
Inventors
Chung-Che Tsai
Wei Shan
Assignee (at issue)
Ultratera Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.