Patent Assignment
Reel/Frame 056452/0177
Assignment of Assignor's Interest
Recorded: 2021-06-07
Pages: 4
Assignor
UTAC TAIWAN HOLDINGS
Executed: 2021-05-17
Assignee
UTAC (TAIWAN) CORPORATION
NO. 2, LI-HSIN 3RD RD., HSINCHU SCIENCE PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Bonding Pads of Printed Circuit Board Capable of Holding Solder Balls Securely
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 21, 2005
From: UNITED TEST CENTER INC.
To: ULTRATERA CORPORATION
Reel/Frame 015928/0108 →
Change of Name
Dec 19, 2017
From: ULTRATERA CORPORATION
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 044442/0224 →
Assignment of Assignor's Interest
Dec 22, 2017
From: UTAC (TAIWAN) CORPORATION
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 044467/0697 →
Assignment of Assignor's Interest
Aug 3, 2020
From: UTAC HEADQUARTERS PTE. LTD.
To: UTAC TAIWAN HOLDINGS
Reel/Frame 053377/0933 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058113/0940 →