IP Library › Assignment 013100/0312
Patent Assignment
Reel/Frame 013100/0312

Assignment of Assignor's Interest

Recorded: 2002-07-11 Pages: 4
Assignor
CHEN, TONG
Executed: 2002-07-08
Assignee
TELEDYNE TECHNOLOGIES INCORPORATED
12333 W. OLYMPIC BOULEVARD, LOS ANGELES, CALIFORNIA, 90064
Covered Property (1)
Multi-Substrate Layer Semiconductor Packages and Method for Making Same
Patent: 6,933,603 →
Application: 10/192,906 →
Publication: US 2004/0007776
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 27, 2005
From: TELEDYNE TECHNOLOGIES INCORPORATED
To: TELEDYNE WIRELESS, INC.
Reel/Frame 015612/0322 →
Change of Name Jan 20, 2009
From: TELEDYNE WIRELESS, INC.
To: TELEDYNE WIRELESS, LLC
Reel/Frame 022127/0198 →
Change of Name Oct 3, 2018
From: TELEDYNE WIRELESS, LLC
To: TELEDYNE DEFENSE ELECTRONICS, LLC
Reel/Frame 047190/0065 →