IP Library › Assignment 013115/0429
Patent Assignment
Reel/Frame 013115/0429

Assignment of Assignor's Interest

Recorded: 2002-07-18 Pages: 4
Assignors
KOBAYASHI, SHOUZOU
Executed: 2002-05-07
FURUKAWA, TAKAMITSU
Executed: 2002-05-14
TANAKA, KEISUKE
Executed: 2002-05-07
SHIMOYAMA, KOUHEI
Executed: 2002-05-07
WATANABE, AKIRA
Executed: 2002-05-07
NISHIMURO, TADASHI
Executed: 2002-05-07
MUTO, KOKI
Executed: 2002-05-07
YANAGISAWA, AZUSA
Executed: 2002-05-07
OSHIMA, KATSUO
Executed: 2002-05-07
Assignee
OKI ELECTRONIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Method and Apparatus for Performing Baking Treatment to Semiconductor Wafer
Patent: 6,838,643 →
Application: 10/197,598 →
Publication: US 2003/0057198
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 4, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022043/0739 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →