Patent Assignment
Reel/Frame 013130/0963
Assignment of Assignor's Interest
Recorded: 2002-07-19
Pages: 2
Assignor
SHIM, JONG BO
Executed: 2002-03-05
Assignee
SAMSUNG ELECTRONIC CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Same