Patent Assignment
Reel/Frame 013136/0925
Assignment of Assignor's Interest
Recorded: 2002-07-22
Pages: 4
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Property
(1)
Methods of Encapsulating Selected Locations of a Semiconductor Die Assembly Using a Thick Solder Mask
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.