Patent Assignment
Reel/Frame 013143/0125
Assignment of Assignor's Interest
Recorded: 2002-08-01
Pages: 3
Assignors
SAKAI, HIROSHI
Executed: 2002-07-17
SUZUKI, MOTOJI
Executed: 2002-07-17
IGARASHI, MAKOTO
Executed: 2002-07-17
TANAKA, AKIHIRO
Executed: 2002-07-17
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Packaging Electronic Components Without Creating Unnecessary Solder Balls
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.