Method of packaging electronic components without creating unnecessary solder balls
A method of packaging an electronic component having electrodes soldered on lands on a printed circuit board uses a mask pattern that corresponds to the lands onto which solder paste is deposited. Solder paste is printed on the lands using the mask which has a convex shape such that the edges of the solder paste lie inside the edges of the lands. The electrodes are then placed on the solder paste, and the solder paste is caused to reflow to solder the electrodes to the lands.
1. A method of manufacturing a package including an electronic component, in which the electronic component has electrodes and is packaged on a printed circuit board in which lands having border edges have been formed in a pattern of arrangement that corresponds to said electrodes by soldering said electrodes to said lands; said method comprising steps of:
arranging a metal mask, in which openings are formed in a pattern corresponding to said lands, on said printed circuit board such that said openings are each positioned over respective said lands, said opening defined by edge regions surrounding said openings;
filling each of said openings with solder paste;
removing said metal mask;
placing said electronic component on said printed circuit board such that said electrodes are each placed on said solder paste; and
performing reflow of said solder paste to solder said electrodes to said lands;
wherein at least one of said openings of said metal mask is formed in a shape such that portions of said edge regions have straight edges and at least a part of said edge regions are positioned inside the border edges of said lands when said metal mask is arranged on said printed circuit board; and
wherein said edge regions of said at least one of said openings is in the shape of a five sided polygon forming a home plate-shape having a convex shape with a vertex facing toward said electronic component, said vertex positioned not inside the border edges of the lands; and
wherein said filling step fills said at least one opening with said solder paste comprises tin-zinc (Sn—Zn) solder that does not contain lead (Pb).
2. The method of manufacturing a package including an electronic component according to claim 1 , wherein said at least a part of said edge regions are positioned inside the border edges of said land in areas on said land in which said electrodes are placed.
3. The method of manufacturing a package including an electronic component according to claim 1 , wherein said electronic component is a leadless chip.
4. The method of manufacturing a package including an electronic component according to claim 1 , wherein said electronic component is a device having L-type leads.