Patent Assignment
Reel/Frame 013151/0687
Assignment of Assignor's Interest
Recorded: 2002-07-25
Pages: 2
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Printed circuit board having plating conductive layer with bumps and its manufacturing method
Application:
10/205,323 →
Publication:
US 2003/0036220
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.