Patent Assignment
Reel/Frame 013170/0379
Assignment of Assignor's Interest
Recorded: 2002-10-14
Pages: 4
Assignors
LAI, DIANE
Executed: 2002-07-24
BERHANE, SAMSON
Executed: 2002-07-24
SNYDER, BARRY C.
Executed: 2002-07-24
HELLEKSON, RONALD A.
Executed: 2002-07-24
PLAS, HUBERT VANDER
Executed: 2002-07-26
Assignee
HEWLETT-PACKARD COMPANY
P.O. BOX 272400, INTELLECTUAL PROPERTY ADMINISTRATION, FORT COLLINS, COLORADO, 80527-2400
Covered Property
(1)
Method of Forming a Through-Substrate Interconnect
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2003
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 013776/0928 →
Assignment of Assignor's Interest
Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →