Patent Assignment
Reel/Frame 013178/0181
Assignment of Assignor's Interest
Recorded: 2002-08-06
Pages: 2
Assignor
MATSUMURA, AKIRA
Executed: 2002-06-24
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Manufacturing Method for Semiconductor Device with a Larger Contact Hole Opening
Patent:
6,511,878 →
Application:
10/212,259 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.