Patent Assignment
Reel/Frame 013178/0590
Assignment of Assignor's Interest
Recorded: 2002-08-07
Received: 2002-08-14
Pages: 2
Assignors
DANNER, HUBERT
Executed: 2002-07-22
HUBEL, THOMAS
Executed: 2002-07-22
MAULER, ARMIN
Executed: 2002-07-22
ROTTGER, KLAUS
Executed: 2002-07-22
Assignee
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
JOHNNES-HESS-STRASSE 24, D-84489 BURGHAUSEN, DEX, GERMANY
Covered Property
(1)
Method and device for producing an adhesive-bonded connection between a semiconductor wafer and a carrier plate
Application:
10/213,522 →