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App. No. 10/213,522 · Confirmation No. 6468

Method and device for producing an adhesive-bonded connection between a semiconductor wafer and a carrier plate

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2005-04-25 ABN Abandonment 2 View
2005-04-25 EXIN Examiner Interview Summary Record (PTOL - 413) 2 View
2004-10-18 CTNF Non-Final Rejection 9 View
2004-10-18 1449 List of References cited by applicant and considered by examiner 2 View
2004-10-18 892 List of references cited by examiner 1 View
2004-10-18 BIB Bibliographic Data Sheet 1 View
2004-10-18 SRFW Search information including classification, databases and other search related notes 1 View
2004-10-12 SRNT Examiner's search strategy and results 1 View
2002-10-07 IDS Information Disclosure Statement (IDS) Form (SB08) 6 View
2002-08-07 TRNA Transmittal of New Application 1 View
2002-08-07 SPEC Specification 13 View
2002-08-07 CLM Claims 3 View
2002-08-07 ABST Abstract 1 View
2002-08-07 DRW Drawings-only black and white line drawings 4 View
2002-08-07 OATH Oath or Declaration filed 4 View
2002-08-07 WFEE Fee Worksheet (SB06) 1 View
2002-08-07 WFEE Fee Worksheet (SB06) 1 View
2002-08-07 FRPR Certified Copy of Foreign Priority Application 13 View
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Quick Facts
App. No.
10/213,522
Filed
2002-08-07
Pub. No.
US20030034110A1
Art Unit
1733