Patent Assignment
Reel/Frame 013178/0639
Assignment of Assignor's Interest
Recorded: 2002-08-12
Pages: 3
Assignors
SAKAI, HIROSHI
Executed: 2002-07-26
SUZUKI, MOTOJI
Executed: 2002-07-26
IGARASHI, MAKOTO
Executed: 2002-07-26
TANAKA, AKIHIRO
Executed: 2002-07-26
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method and Apparatus for Printing Solder Paste of Different Thickness on Lands on Printed Circuit Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.