Patent Assignment
Reel/Frame 013192/0691
Assignment of Assignor's Interest
Recorded: 2002-10-23
Pages: 3
Assignor
HIROSHIMA, YASUSHI
Executed: 2002-09-05
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Thin-Film Manufacturing Method, Semiconductor Device Manufacturing Method, Semiconductor Device, Integrated Circuit, Electro-Optical Device, and Electronic Appliance