Patent Assignment
Reel/Frame 013215/0171
Assignment of Assignor's Interest
Recorded: 2002-08-20
Pages: 3
Assignors
TERUNUMA, ICHIRO
Executed: 2002-08-07
AKASHI, KAZUYA
Executed: 2002-08-07
MOMOTA, ATSUSHI
Executed: 2002-08-05
Assignee
FUJIKURA LTD.
5-1, KIBA 1-CHOME, KOHTOH-KU, TOKYO, JAPAN
Covered Property
(1)
Interlayer Connection Structure of Multilayer Wiring Board, Method of Manufacturing Flexible Printed Circuit Board and Method of Forming Land Thereof