Patent Assignment
Reel/Frame 013215/0824
Assignment of Assignor's Interest
Recorded: 2002-08-22
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
3-6 AKASAKA 5-CHOME, MINATO-KU, TOKYO 107-8481, JAPAN
Covered Property
(1)
Method of Forming a Barrier Film and Method of Forming Wiring Structure and Electrodes of Semiconductor Device Having a Barrier Film