Patent Assignment
Reel/Frame 013257/0978
Assignment of Assignor's Interest
Recorded: 2002-09-04
Pages: 2
Assignors
SHINGUBARA, SHOSO
Executed: 2002-08-19
TAKAHAGI, TAKAYUKI
Executed: 2002-08-19
SAKAUE, HIROYUKI
Executed: 2002-08-19
Assignee
SEMCONDUCTOR TECHNOLOGY ACADEMIC RESEARCH CENTER
3-17-2, SHIN-YOKOHAMA, KOHOKU-KU, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Electroless Plating Process and Embedded Wire and Forming Process Thereof