Patent Assignment
Reel/Frame 013269/0018
Assignment of Assignor's Interest
Recorded: 2002-09-09
Received: 2002-09-13
Pages: 39
Assignor
CONEXANT SYSTEMS, INC.
Executed: 2002-06-25
Assignee
SKYWORKS SOLUTIONS, INC.
20 SYLVAN RD., WOBURN, MA, 01801, UNITED STATES
Covered Properties
(29)
Method for Fabrication of a Heterojunction Bipolar Transistor
Application:
10/190,011 →
Method for Metallization of a Semiconductor Substrate and Related Structure
Application:
10/163,662 →
Rate Adaptation for Use in Adaptive Multi-Rate Vocoder
Application:
10/124,464 →
Structure and Method in an Hbt for an Emitter Ballast Resistor with Improved Characteristics
Application:
10/115,317 →
High Performance Bifet Low Noise Amplifier
Application:
10/057,098 →
Structure for a Heterojunction Bipolar Transistor
Application:
10/034,880 →
Laminate Package Embedded Antenna
Application:
10/026,134 →
Method for Integrating Passives on-Die Utilizing Under Bump Metal and Related Structure
Application:
10/025,438 →
Shielded Antenna in a Semiconductor Package
Application:
10/020,105 →
Leadless Chip Carrier for Reduced Thermal Resistance
Application:
10/013,130 →
Controlled Impedance Leads in a Leadframe for High Frequency Applications
Application:
10/012,792 →
Controlled Impedance Transmission Lines in a Redistribution Layer
Application:
10/012,812 →
Flip-Chip Leadframe Package
Application:
10/013,023 →
Off-Chip Inductor
Application:
10/016,309 →
Multiple Chip Module with Integrated Rf Capabilities
Application:
10/020,380 →
High Inductance Inductor in a Semiconductor Package
Application:
09/972,706 →
Voltage Regulation for Semiconductor Dies and Related Structure
Application:
09/971,162 →
Structure and Method for Fabrication of a Leadless Chip Carrier with Embedded Inductor
Application:
09/930,747 →
Structure and Method for Fabrication of a Leadless Chip Carrier with Embedded Antenna
Application:
09/916,666 →
Structure and Method for Fabrication of a Leadless Multi-Die Carrier
Application:
09/894,728 →
Structure and Method for Fabrication of a Leadless Chip Carrier
Application:
09/878,815 →
Leadless Flip Chip Carrier Design and Structure
Application:
09/877,912 →
Erectable shelter with collapsible central roof support
Application:
09/844,836 →
Collapsible Shelter with Flexible, Collapsible Canopy
Application:
09/844,055 →
System for Associating User Selectable Information in Wireless Devices
Application:
09/842,601 →
Method and Apparatus for Motion Compensated Video Coding
Application:
09/828,535 →
Temperature Stabilization in Flip Chip Technology
Application:
09/799,446 →
Transformer Comprising Stacked Inductors
Application:
09/797,307 →
On-Chip Transformers
Application:
09/779,402 →