IP Library › Granted Patent US 6,614,117
Granted Patent Utility
US 6,614,117 · Confirmation No. 9437

METHOD FOR METALLIZATION OF A SEMICONDUCTOR SUBSTRATE AND RELATED STRUCTURE

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 Code Description Pages PDF
2002-06-04 TRNA Transmittal of New Application 3 View
2002-06-04 SPEC Specification 15 View
2002-06-04 CLM Claims 6 View
2002-06-04 ABST Abstract 1 View
2002-06-04 DRW Drawings-only black and white line drawings 4 View
2002-06-04 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,614,117
App. No.
10/163,662
Filed
2002-06-04
Granted
2003-09-02
Art Unit
2815
PTA
0 days