IP Library › Granted Patent US 6,596,635
Granted Patent Utility
US 6,596,635 · Confirmation No. 4977

METHOD FOR METALLIZATION OF A SEMICONDUCTOR SUBSTRATE

Patented Case View Patent ↗
⬇ PDF
 Code Description Pages PDF
2002-10-11 TRNA Transmittal of New Application 4 View
2002-10-11 A.PE Preliminary Amendment 3 View
2002-10-11 SPEC Specification 15 View
2002-10-11 CLM Claims 6 View
2002-10-11 ABST Abstract 1 View
2002-10-11 DRW Drawings-only black and white line drawings 4 View
2002-10-11 OATH Oath or Declaration filed 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,596,635
App. No.
10/269,729
Filed
2002-10-11
Granted
2003-07-22
Art Unit
2818
PTA
-5 days