IP Library Assignment 013275/0096
Patent Assignment
Reel/Frame 013275/0096

Assignment of Assignor's Interest

Recorded: 2002-09-05 Pages: 6
Assignors
BRAZIS, PAUL
Executed: 2002-09-04
CHASON, MARC
Executed: 2002-09-05
GAMOTA, DANIEL
Executed: 2002-09-04
KALYANASUNDARAM, KRISHNA
Executed: 2002-09-04
Assignee
MOTOROLA, INC.
1303 EAST ALGONQUIN ROAD, LAW DEPARTMENT, SCHAUMBURG, ILLINOIS, 60196
Covered Property (1)
Thinned Semiconductor Wafer and Die and Corresponding Method
Patent: 6,780,733 →
Application: 10/236,619 →
Publication: US 2004/0048445
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 6, 2011
From: MOTOROLA, INC
To: MOTOROLA SOLUTIONS, INC.
Reel/Frame 026081/0001 →