IP Library Assignment 013319/0097
Patent Assignment
Reel/Frame 013319/0097

Assignment of Assignor's Interest

Recorded: 2002-12-30 Pages: 2
Assignors
SUMMERS, JOHN DONALD
Executed: 2002-11-20
SUTTON JR., RICHARD FREDERICH
Executed: 2002-11-25
AUMAN, BRIAN CARL
Executed: 2002-11-20
Assignee
E. I. DUPONT DE NEMOURS AND COMPANY
LEGAL PATENTS, BARLEY MILL PLAZA 25, WILMINGTON, DELAWARE, 19880-0025
Covered Property (1)
High Modulus Polyimide Compositions Useful as Dielectric Substrates for Electronics Applications, and Methods Relating Thereto
Patent: 6,956,098 →
Application: 10/251,134 →
Publication: US 2004/0058172
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →