Patent Assignment
Reel/Frame 013335/0607
Assignment of Assignor's Interest
Recorded: 2002-09-24
Pages: 3
Assignors
CHEN, YI-NAN
Executed: 2002-09-11
HUANG, TUNG-WANG
Executed: 2002-09-11
HO, HSIN-JUNG
Executed: 2002-09-11
LIU, HSIEN-WEN
Executed: 2002-09-11
Assignee
NANYA TECHNOLOGY CORPORATION
HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN, TAOYUAN, R.O.C., TAIWAN
Covered Property
(1)
Method of Forming a Bottle-Shaped Trench in a Semiconductor Substrate