Patent Assignment
Reel/Frame 013361/0073
Assignment of Assignor's Interest
Recorded: 2002-09-30
Pages: 2
Assignors
TSAI, SHIANN-TSONG
Executed: 2002-08-25
HSU, YU-MING
Executed: 2002-08-25
WU, WEN-LUNG
Executed: 2002-08-25
CHEN, KUEN-HUANG
Executed: 2002-08-25
SU, WEN-SHENG
Executed: 2002-08-25
LIN, CHIN-HSING
Executed: 2002-08-25
Assignee
ULTRATERA CORPORATION
NO. 2, LI-HSIN ROAD, 3, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Multi-Chip Semiconductor Package and Fabrication Method Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 19, 2017
From: ULTRATERA CORPORATION
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 044442/0224 →
Assignment of Assignor's Interest
Dec 22, 2017
From: UTAC (TAIWAN) CORPORATION
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 044467/0697 →
Assignment of Assignor's Interest
Aug 3, 2020
From: UTAC HEADQUARTERS PTE. LTD.
To: UTAC TAIWAN HOLDINGS
Reel/Frame 053377/0933 →
Assignment of Assignor's Interest
Jun 7, 2021
From: UTAC TAIWAN HOLDINGS
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 056452/0396 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058113/0325 →