Patent Assignment
Reel/Frame 013361/0666
Assignment of Assignor's Interest
Recorded: 2002-09-04
Pages: 2
Assignors
TAKAHASHI, TERUO
Executed: 2002-07-23
WATANABE, MOTOYUKI
Executed: 2002-07-23
TAKAHASHI, HIDENORI
Executed: 2002-07-23
Assignee
HAMAMATSU PHOTONICS K.K.
1126-1, ICHINO-CHO, HAMAMATSU-SHI, SHIZUOKA 435-8558, JAPAN
Covered Property
(1)
Thickness Measuring Apparatus, Thickness Measuring Method, and Wet Etching Apparatus and Wet Etching Method Utilizing Them