Patent Assignment
Reel/Frame 013383/0389
Assignment of Assignor's Interest
Recorded: 2002-10-09
Pages: 2
Assignor
SINHA, NISHANT
Executed: 2002-09-27
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83706
Covered Property
(1)
Methods of Forming Conductive Through-Wafer Vias
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.