IP Library Assignment 013389/0637
Patent Assignment
Reel/Frame 013389/0637

Assignment of Assignor's Interest

Recorded: 2002-10-15 Pages: 2
Assignors
FAZELPOUR, SIAMAK
Executed: 2002-09-23
PAPILLON, JEAN-MARC
Executed: 2002-09-23
MARTIN, STEVEN J.
Executed: 2002-09-15
Assignee
APPLIED MICRO CIRCUITS CORPORATION
6290 SEQUENCE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Electronic Package Substrate with an Upper Dielectric Layer Covering High Speed Signal Traces
Patent: 6,762,494 →
Application: 10/254,120 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 21, 2008
From: APPLIED MICRO CIRCUITS CORPORATION
To: QUALCOMM INCORPORATED
Reel/Frame 021876/0013 →
Merger Sep 9, 2009
From: APPLIED MICRO CIRCUITS CORPORATION
To: APPLIED MICRO CIRCUITS CORPORATION
Reel/Frame 023196/0950 →