Patent Assignment
Reel/Frame 013415/0397
Assignment of Assignor's Interest
Recorded: 2002-10-18
Received: 2002-10-29
Pages: 6
Assignors
BULLER, JAMES F.
Executed: 2002-10-03
WRISTERS, DERICK J.
Executed: 2002-10-03
XIANG, QI
Executed: 2002-10-03
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, SUNNYVALE, CA, 94088-3453, UNITED STATES
Covered Properties
(2)
Methods for Producing Packaged Integrated Circuit Devices and Packaged Integrated Circuit Devices Produced Thereby
Application:
10/277,498 →
Semiconductor Device with Tensile Strain Silicon Introduced by Compressive Material in a Buried Oxide Layer
Application:
10/272,979 →