Patent Assignment
Reel/Frame 013420/0636
Assignment of Assignor's Interest
Recorded: 2003-02-12
Pages: 3
Assignee
VIA TECHNOLOGIES, INC.
8F, NO.533, CHUNG-CHENG RD., HSIN-TIEN CITY, TAIPEI HSIEN, TAIWAN
Covered Property
(1)
Chip Scale Package with Heat Dissipating Part