IP Library › Assignment 013431/0944
Patent Assignment
Reel/Frame 013431/0944

Assignment of Assignor's Interest

Recorded: 2002-10-24 Pages: 2
Assignor
WYLAND, CHRIS
Executed: 2002-10-22
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDOVEN, 5621 BA, NETHERLANDS
Covered Property (1)
Thermal-Conductive Substrate Package
Patent: 6,778,398 →
Application: 10/279,703 →
Publication: US 2004/0080915
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
Assignment of Assignor's Interest Feb 17, 2009
From: NXP B.V.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 022266/0047 →