IP Library › Assignment 013435/0392
Patent Assignment
Reel/Frame 013435/0392

Assignment of Assignor's Interest

Recorded: 2002-10-25 Pages: 3
Assignor
YAMAMOTO, KATSUMI
Executed: 2002-10-07
Assignee
HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
1325 HUAIHAI M. ROAD, SUTIE 1003, SHANGHAI, 200031, CHINA
Covered Property (1)
Method for Making and Packaging Image Sensor Die Using Protective Coating
Patent: 6,808,960 →
Application: 10/280,974 →
Publication: US 2004/0082094
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 27, 2003
From: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
To: OMNIVISION INTERNATIONAL HOLDING LTD
Reel/Frame 014624/0578 →
Assignment of Assignor's Interest May 25, 2004
From: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
To: OMNIVISION INTERNATIONAL HOLDING LTD
Reel/Frame 014653/0044 →